Electronics Forum | Mon Mar 18 15:33:12 EST 2002 | John Z.
I would shy away from a Dremel. They are great for a hobby, but produce too much spin off at the tip to be reliable. A micro-drill is the appropriate tool. The cheap way out would be tweezers scissors. That is if you can get under the trace.
Electronics Forum | Tue Jan 14 20:48:10 EST 2003 | davef
I'll do you one better. I can't even find anything about "LPMTF and EMTF" on UIC.com. Having never been one that been shy about showing his ignorance, what do the terms "LPMTF and EMTF" mean?
Electronics Forum | Thu May 29 16:14:34 EDT 2003 | steves
What is the general feeling in the industry on the use of 15.7 mil QFP's? Are most people shying away from them in favor of BGA or do most people consider 15.7 mil to be "standard" technology these days? What special considerations are involved? Ste
Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef
Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.
Electronics Forum | Sat Dec 01 22:25:32 EST 2007 | molos21
Shy You should try SMT-5. First solder PTH comps, then apply paste with your pick and place and apply glue with ur screen printer and come back to place smd with pick and place and then reflow. You will get great results. Good luck
Electronics Forum | Fri Jul 20 10:35:34 EDT 2001 | slthomas
David, I've thought about doing this also with no clean boards that were poorly cleaned following a misprint (and subsequently reprinted, populated, and reflowed) but have shyed away because of the potential for damage to components from the ultraso
Electronics Forum | Wed Jun 04 05:13:09 EDT 2003 | emeto
Hi Pete I agree with all that. But his question was "Are most people shying away from them in favor of BGA or do most people consider 15.7 mil to be "standard" technology these days?" So, the truth is people use both.QFP has advantages and disadvanta
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Wed May 19 15:42:46 EDT 2010 | davef
Hear ya. Mostly, we production people. So, we shy away from home brew soldering techniques, unless we get ourselves in a mess. That being said, there's a fair amount of stuff on the web about home brew BGA and fine pitch QFP soldering. Here's an
Electronics Forum | Fri Mar 31 14:24:10 EST 2000 | JAX
Hey Dave, thanks for the sparkling endorsement! No really, You have to be realistic when presenting your case. Once you understand that company decisions, like it or not, are based on the bottom line, the way you present your case will be clearer. I
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