Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Wed May 29 02:01:10 EDT 2024 | kumarb
No direct experience with these parts but to me, the air flow from top side fans are creating a wind tunnel that is causing the smaller parts to fly. Can you adjust the speed of these fans? Review the paste - review the component mount height. We fac
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Tue Mar 13 17:29:18 EDT 2007 | Oswaldo Rey
I placed a Maxim MAX16810 38 pin TQFN with a power pad ground on the bottom of the chip on a prototype board FR4 doble sided. Vias of 0.6 mm where placed underneath part, 6 vias in total. Solder was placed with an air operated syringe, land pattern w
Electronics Forum | Thu Jul 20 12:38:55 EDT 2000 | Bob Willis
The first time I was faced with this it was on a night shift training M ?????????? and we used a standard hot air rework system with no under board heating. The trick is to keep the air flow low and you can remove the parts. Most people use too highe
Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob
Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi
Electronics Forum | Wed Apr 22 08:40:18 EDT 2015 | markhoch
Hi Myriam, I think we may need some more information. Is the Electrolytic (Aluminum) Capacitor placed more than once per board? If so, are all locations twisting? This would typically be caused by a thermal imbalance that could be design induced. (u
Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas
Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo
Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
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