Electronics Forum | Tue Feb 18 16:31:43 EST 2003 | arturoflores
Haran: Have you made improvements regarding your BGA shorts? We are facing the same problem and we think it is partly because the non coplanarity of the seating plane of the BGA which causes BGA balls to squeeze on one side of the BGA. Also, we ha
Electronics Forum | Thu Mar 02 10:09:02 EST 2017 | rvines1
We have a board with an LQFP-176 with 0.5mm pitch. We regularly have to rework these due to unsoldered pins, which is due to pins that are slightly bent upward. We believe that we are receiving them this way, but it may also be due to handling on o
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Mon Sep 20 19:52:18 EDT 2004 | pabloquintana
We use axial components together with some SMDs on the same board. Because the components have leads greater than .180 we have to Roto trim them after wave soldering. We are looking into avoiding the roto trimming of the boards, but we need to find
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Mon Jun 12 09:47:18 EDT 2006 | patrickbruneel
Hi Grant, You definitely have a pre-heat problem and not a flux problem. Pallets together with the BNC connectors put a large thermal demand on your pre-heating. 3 zones would be a good investment even with leaded solder due to the high thermal dema
Electronics Forum | Tue Jul 18 12:27:29 EDT 2006 | Nick
What are the root failures of PCB Blistering / Delamination? Could layers short together through vias or thru-holes?
Electronics Forum | Wed Apr 25 13:28:12 EDT 2001 | davef
You can make bare BGA balls short together, depending on how you choose to heat the device. Lookit .. [http://davesmt.50megs.com/pictures/ select bgashortng.avi]
Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew
We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !
