Electronics Forum | Mon Aug 31 17:31:52 EDT 1998 | Scott McKee
| We do have plans to have users register themselves in order to post messages. People can still read, but cannot post without setting up a "user profile". I will make it short, so users can be up and running in 5 minutes. The profile will have priva
Electronics Forum | Wed Aug 12 14:39:09 EDT 1998 | Mike C
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Tue Aug 04 12:15:33 EDT 1998 | Steve Gregory
| | | | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | | Also, has an
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Wed Jun 24 23:52:41 EDT 1998 | Phillip Hunter
| Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. | What could be causing this? This has only been detected on one of our products. All the re
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Tue Jun 16 15:39:43 EDT 1998 | Steve Gregory
| | I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. | | Deeply invloved in micro BG
