Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Mon Feb 03 23:55:58 EST 2003 | MA/NY DDave
Hi If this is the tombstoning I know which is evidenced by parts touching each other and some obvious colored material at the edges just wash them again real good. Now you might want to do some IR tests just in case you will have a reliability hit.
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John
What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.
Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F
John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the
Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis
A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil
Electronics Forum | Tue Jun 20 22:52:10 EDT 2006 | davef
We all know those academic 'reliability studies' are very focused and only give a snapshot of real life. The real reliability studies of leadfree are starting as we scramble to meet our numbers. We have no idea about your customers' expectations ab
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
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