Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry
We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti
Electronics Forum | Mon Feb 28 20:17:02 EST 2000 | Eldon Sanders
I need to side mount a standard HC-49/U crystal on a board using double sided foam tape. I am looking for a source for pre-cut foam tape. In prototype runs I have used 3M #4950 foam tape cut to size one at a time. But for production I want it pre-
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk
We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
Electronics Forum | Tue Jun 19 17:33:09 EDT 2001 | genny
We don't actually leave the residue on the board, even though the Kester spec sheet says it is ok not to clean - we do spot hand cleaning with Safety Wash. Kester also said that there shouldn't be any problem with mixing RA with no-clean, although w
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Wed Jan 05 11:01:37 EST 2000 | Ron Lahat
I have in design a 400mm x 400mm pcb 3.0 mm thick heavily populated with BGAs 50 mil pitch and want to run a double sided reflow process with overlapping BGAs (CS/PS) 1. can I avoid a selective jig for PS BGAs?(weight calculation ?) 2. Is it possibl
