Electronics Forum: sided (Page 135 of 507)

CP43 Placing problem on PLCC28

Electronics Forum | Sat Nov 13 00:50:05 EST 2004 | KEN

Place the part on a board with double sided sticky tape. I bet the part is sliding around AFTER mounting. The tape would proove this. Also, are you sure your not dragging on the scrap counter? Maybe the height of the part is just touching the un

Novastar Wave Soldering Machine

Electronics Forum | Thu Jan 20 14:26:34 EST 2005 | clampron

I had worked with one some time ago. The preheat was not powerfull enough and we had a difficult time with the tope side flow. Good Luck

Best Land Pattern design for 0402 Resitors?

Electronics Forum | Fri Jan 14 12:59:07 EST 2005 | Dan Mendoza

I have used the rectangle shapes and round shapes with no noticible difference. The idea is to design the pads to accept the same solder volume per component. Components over two size pads will favor the higher solder volume side during reflow.

MSOP W/Bottom Pad - Processing

Electronics Forum | Tue Feb 08 14:14:23 EST 2005 | Jim V.

Looking for suggetions on improving the bottom side connection on MSOP package. What is the common paste / pad / stencil aperture practice?

White tin pcb, smt production

Electronics Forum | Tue Mar 01 08:21:37 EST 2005 | David Bratcher

What thickness is required to process a double sided board with white tin? Is there an IPC standard? If rework is necessary, what is required?

Double Sided Reflow

Electronics Forum | Thu Mar 17 10:30:06 EST 2005 | davef

This happens. You may need to put a dot of chip bonder on the corner of the floating QFP after first pass. What size are the QFP that are moving?

Double Sided Reflow

Electronics Forum | Thu Mar 17 10:34:34 EST 2005 | Rob

Or... If you have an inline glue dispensor, after printing put a glue dot in the centre of the footprint & this should hold it. Rob.

Double Sided Reflow

Electronics Forum | Mon Mar 21 10:34:02 EST 2005 | py (france)

it's definitively not possible.. printer/chip shooter/pick and place/reflow and printer/chip shooter/pick and place/reflow.

Double Sided Reflow

Electronics Forum | Tue Mar 22 06:11:17 EST 2005 | Grant

Hi, Yes it costs more, but would get full speed production. We design our own products, so can fit them to manufacturing which is nice. Currently that means no underside components at all! Regards, Grant

Via tenting/filling with BGAs

Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN

I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.


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