Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
Electronics Forum | Wed Feb 02 21:17:55 EST 2000 | Steve Harshbarger
Istvan, The advise from both Roni and Mike sounds right on the money. The problem is most likely that your PCB is not completely dry (the flux has not completely evaporated) in the area where these solder balls occur. You have a number of differen
Electronics Forum | Wed Aug 25 09:53:40 EDT 1999 | lwk
| | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | Most common reason is uneven heating where
Electronics Forum | Wed Aug 25 15:47:25 EDT 1999 | JohnW
| | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | Most common reason is uneven hea
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Thu Jul 29 12:24:59 EDT 1999 | DLKearns
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
Electronics Forum | Sat Mar 20 09:02:47 EST 1999 | John W
John, SOT 23's on the bottom side is no real problem...as long as you get the orientaion to the wave right and you remember to increase the pad sizees to allow the solder to get to the pads. Soldering with only one wave would be trick as Vinesh sugg
