Electronics Forum: siemens d4 d3 (Page 1 of 1)

BGA attach eval.

Electronics Forum | Tue Apr 01 17:29:58 EST 2003 | davef

R1: So if I understand you right, it could be possible that gold dissolved, but the ball still didn't wet to the underlying nickel. D1: Correct. The gold dissolves into the solder first. The solder wets to the nickel second. If you nickel is corro

BGA attach eval.

Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef

R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl

BGA attach eval.

Electronics Forum | Thu Apr 03 11:17:17 EST 2003 | rdr

Well, first off now I'm just starting to believe that we are fracturing again. But here is some more input D1 ENIG? I would not have thought that they would be but as usual you are probably right. D2 Again I would have to agree about it should affe

Micro BGA pads, adhesion to laminate

Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef

A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s

GEM / TOPAZ XII forgotten admin password

Electronics Forum | Sat Apr 09 01:41:47 EDT 2022 | glasscake

Fixed it, had to go to another one of my gem x2 machines make a user account with admin permissions. Copy the line of code in the "VtOperatorDef.txt" file under d:system that specifies that user into the text file on my topaz xii. V #BEGIN,OPERATOR

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Re: Component Packaging Trends

Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc

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