Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
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