Electronics Forum | Thu Apr 25 10:00:25 EDT 2019 | SMTA-Gregory
I would suggest you look a the Sikama International Falcon 5 benchtop reflow system, Economical, reliable and good value. You may be able to get one on the used equipment market.
Electronics Forum | Mon May 22 16:58:37 EDT 2006 | flipit
The best small reflow oven that I have ever used is the Sikama brand. Unfortunately they are not inexpensive and you will pay almost as much as you would for a full size reflow oven. Interestingly this is the oven I qualified for lead free and othe
Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME
Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
Electronics Forum | Sun Nov 07 21:40:14 EST 1999 | Chris
I am looking for an inertable reflow oven which will produce ROLs of less than 10 ppm. My current reflow oven will reduce oxygen levels to 10 ppm but only when using excessive nitrogen gas (4000 scfh). In reality less gas flow may reduce oxygen lev
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Mon Apr 19 11:04:21 EDT 2010 | baildl632
We have had some unusual reflow conditions with BGA's as well. We did not come to the conclusion that something was covering the lands though. It typically occured with only the BGA lands (not the decoupling caps on the back side). We found that the
Electronics Forum | Tue Feb 11 13:41:54 EST 2003 | Stephen
How are you doing things now? I'm trying to picture a place going from no reflow oven to a reflow oven without also getting a screen printer at the same time. Are you now handsoldering parts on? With these batchs you plan on doing are you going to
Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
