Electronics Forum: silver epoxy gold end termination (Page 1 of 2)

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Solder Paste with/without silver

Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef

Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i

Screen Printing Adhesive

Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef

USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox

electrically conductive adhesives

Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef

We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F

| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

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