Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital
Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave
Electronics Forum | Fri Aug 30 11:53:12 EDT 2002 | genny
Possibly this is tarnish? Silver finish requires a bit more care in handling or packaging - to avoid contact with sulphur which may cause tarnish. Some cardboard boxes gas out enough sulphur to cause a problem. Possibly look at your method of stora
Electronics Forum | Thu Aug 12 18:06:09 EDT 2004 | SR
May I ask what component types you are using and who the suppliers are? FYI - If the components have exceeded their shelf life, they may have oxidized too much for soldering using low activity fluxes. Thanks and best regards, SR
Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard
Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
Electronics Forum | Fri Aug 30 04:44:31 EDT 2002 | jason
Hi Dave, Why does it become " a bear" if u leave it unsoldered ?? Does it oxidise or something ?? Question (1): Does Ag imm. PCB need to use Solder paste with AG ?? If yes, why. Question (2): Does Ag imm pcb have poorer surface finishes than HAS
Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef
Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
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