Electronics Forum: silver immersion dewetting (Page 7 of 31)

Re: Entek coating

Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon

| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak

Re: Entek coating

Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter

| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef

Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon

| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest

PCB Type

Electronics Forum | Wed Jun 21 09:21:37 EDT 2006 | don dawson

I've been building boards for a long time and have never heard of anyone using electrolytic silver. Immersion silver would be 8-18 microinches thick. Plated silver would be significantly thicker (min a couple tenths - .0002" and up). So you may be ab

Immersion Silver Board Finishes

Electronics Forum | Tue Jul 25 09:42:52 EDT 2006 | razor9114

Good morning, I got a question regarding Immersion Silver Board Finish. It has been imposed on us by our customer that we must manufacture PCB through the SMT process within 24 hours of breaking the seal on a bag of PCB containing Immersion Silver.

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 15:07:50 EST 2003 | davef

YiEng, MA/NY DDave: Usually when the gold plating bath goes south, you loose solderability.

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Sun Mar 09 19:55:56 EST 2003 | iman

Which specific title books from under your pen, would you recommend for the avid process reader/learner? specific - talking about info/process/data wealth books, and not which books give the most royalties *grinz*

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Tue Mar 11 12:20:13 EST 2003 | Jim

Look at "Dave's Book Shelf" here: http://www.smtinfocus.com/bookshelf/bookshelf.html


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