Electronics Forum | Sun Sep 21 10:55:52 EDT 2008 | vladig
As long as the surface is solderable, you should be fine. Silver tarnish a well0-known thing. Make sure, though, there is no sulfur (S) "around". Regards, Vlad
Electronics Forum | Tue Sep 23 10:06:29 EDT 2008 | Sean
Hello Vlad, Davef, Your valuable inputs are much appreciated. Many thanks, Sean.
Electronics Forum | Sat Sep 20 07:11:28 EDT 2008 | Sean
Hello All, I used to hear that PCB with immersion silver finishing, its non component location pads, tend to be discolour (Yellowish) after went through heat cycle, such as reflow oven. However, if the component solderbility on the PCB is OK, can w
Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Fri Aug 30 11:53:12 EDT 2002 | genny
Possibly this is tarnish? Silver finish requires a bit more care in handling or packaging - to avoid contact with sulphur which may cause tarnish. Some cardboard boxes gas out enough sulphur to cause a problem. Possibly look at your method of stora
Electronics Forum | Sun Sep 08 19:58:57 EDT 2002 | dasal
My specialty. Your right, Most corrugated contains S02 and the pallet is usually out gassing formic acid as well. Not a great environment for silver. Original press release follows: Reactive Polymers At AT&T Bell Labs, John P. Franey has developed
Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h
Electronics Forum | Mon Aug 03 12:18:42 EDT 1998 | John Sikes
We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several ru
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