Electronics Forum: silver immersion vs enig (Page 1 of 9)

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 11:49:44 EDT 2004 | Kris

Hi Guys thanks for the replies. Dave, the spec is not for enig but for hard gold does your response alter if thats the case /

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris

what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef

As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Immersion silver leaching.

Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken

I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O

Chosing ENIG vs OSP

Electronics Forum | Tue Jun 02 17:45:46 EDT 2009 | boardhouse

Hi Nicoleta, As a board shop, either are good choices but in my experience with my customers ENIG has alway been the favorite due to it is easier to work with in regards to not having to tweak your equipment. As long as the board shop that you are u

ENIG vs Flash Gold

Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris

Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b

ENIG vs Flash Gold

Electronics Forum | Sat Mar 25 07:10:12 EST 2006 | davef

We agree with Chris. If your gold is applied properly and is the correct thickness, you will see no difference. One nit on Chris' comments: immersion gold will plate-out [self-limit] around 8 thou, although we've heard 12 thou.

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