Electronics Forum | Mon Jul 09 18:11:20 EDT 2012 | rsikora
Your selection of pads to use as Fids will be critical. In your pictures of the QFN component, the pcb pads are primarily non-solder mask defined, but on 3 sides of the QFN the corner pads become solder mask defined due to the copper ground flood.
Electronics Forum | Wed Feb 03 12:01:11 EST 2010 | pbarton
We use woven Kevlar gloves and gauntlets. Try Ansell or similar manufacturers. Pete B.
Electronics Forum | Tue Feb 09 12:47:56 EST 2010 | swag
Refer to the thread started by Deni on 2/4/10. Your problem is similar.
Electronics Forum | Sat May 15 09:28:44 EDT 2010 | dekhead
I worked with a customer about 2 years ago on a process similar using ProFlow head to put paste in holes for through hole... Similar to Pin in Paste. Somewhat successful; but ran into heat related damage issue from TH components through reflow.
Electronics Forum | Mon Feb 08 15:51:29 EST 2010 | baildl632
Did both board suppliers use the same CAD data to build the boards? We've seen similar where the CAD data was incorrect causing whoever to build the boards incorrectly.
Electronics Forum | Sun May 16 00:07:58 EDT 2010 | tpappano
I have a Philips CSM84VZ. There are offset calibrations that compensate the X and Y distances from the camera to the heads and the beam pointer. Perhaps yours is similar and just needs a small Y adjustment for the beam pointer.
Electronics Forum | Fri May 21 07:44:28 EDT 2010 | mun4o
hi, I have similar problem 2 year ago.BGA256 , hole in pad technology.I order PCB manifacturer to fill hole with solder mask.And now everything is ok. regards
Electronics Forum | Fri Jun 04 13:23:54 EDT 2010 | mmjm_1099
For the machines that are similar I would start by making sure the model name and machine name are different. The machine type can be the same but you need to add a different sufix at the end or something. See if this helps and should be able to do s
Electronics Forum | Tue Jul 13 14:25:09 EDT 2010 | davef
While you're waiting for others to reply, here's link to a recent thread that seems similar to yours: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=14787&mc=13
Electronics Forum | Wed Sep 15 04:12:11 EDT 2010 | headlad
We had a similar problem so we shrunk the thermal and extended the pads. This allowed us to ensure solder resist was applied to the track in between. It fixed our problem.
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