Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef
Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop
Electronics Forum | Thu Sep 18 15:26:04 EDT 2008 | ismir
Dear Hegemon, I'm very grateful for your help. There is one more thing that I'd like to discuss with you. I'd like to know if there is any "verification board" or something like that to check if you really did a good job. At the company where I wo
Electronics Forum | Thu Jan 04 03:01:38 EST 2018 | buckcho
As always, our good colleague Evtimov is right about the AOI and oven. For the AOI you need to make a golden sample board(panel) and test if your machine can catch all defects that you simulated BEFORE the oven. Try to me as accurate to real defects
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
