Electronics Forum: siplace d3 d4 (Page 1 of 1)

BGA attach eval.

Electronics Forum | Tue Apr 01 17:29:58 EST 2003 | davef

R1: So if I understand you right, it could be possible that gold dissolved, but the ball still didn't wet to the underlying nickel. D1: Correct. The gold dissolves into the solder first. The solder wets to the nickel second. If you nickel is corro

BGA attach eval.

Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef

R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl

BGA attach eval.

Electronics Forum | Thu Apr 03 11:17:17 EST 2003 | rdr

Well, first off now I'm just starting to believe that we are fracturing again. But here is some more input D1 ENIG? I would not have thought that they would be but as usual you are probably right. D2 Again I would have to agree about it should affe

Micro BGA pads, adhesion to laminate

Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef

A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s

GEM / TOPAZ XII forgotten admin password

Electronics Forum | Sat Apr 09 01:41:47 EDT 2022 | glasscake

Fixed it, had to go to another one of my gem x2 machines make a user account with admin permissions. Copy the line of code in the "VtOperatorDef.txt" file under d:system that specifies that user into the text file on my topaz xii. V #BEGIN,OPERATOR

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