Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo
Electronics Forum | Fri May 21 15:40:58 EDT 1999 | JohnW
| | | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | | | your help is greatly appreciated...thanks | | | | | | omat marasigan
Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao
Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon
Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC
When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Fri Jun 15 14:05:20 EDT 2001 | CPI
In response No that�s not all you need to think about, but lets look at each and then talk of others. a)The condition of the solderable surface on boards (and components) degrades over time or can be supplied in poor condition (to thin or thick HASL
Electronics Forum | Thu Sep 09 13:31:26 EDT 1999 | Brian W.
| | My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
