Electronics Forum | Mon Apr 26 22:25:04 EDT 1999 | Big K
75) but the right thing is to change the light source in the robot that is rejecting PLCC's..it worked for us!!! | | Larry, | | | | I have seen this problem on our machine with PLCC 28's, same part same PD, same program except head 2 would place hea
Electronics Forum | Tue Nov 06 06:23:31 EST 2007 | clampron
Good Morning Roger, The Mirtec's can be adjusted to lower your false call rate. This can be done by reducing the matching percentage for each componnent but the result of this action is that the machine becomes less selective. If you lower them too
Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef
Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Tue Oct 27 15:56:29 EDT 2020 | tamasmagyar
Hi Processman, Where I worked before, as an SMT Department Leader, there were two more departments who ran SMT lines, and we had a task from the CEO to decide to how we measure our performances. The result was like this: - first of all, you will ha
Electronics Forum | Thu Sep 16 21:28:44 EDT 1999 | JAX
| I have a number of hopefully easy questions: | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others?
Electronics Forum | Wed May 01 20:48:44 EDT 2002 | ianchan
Hi, I agree that professional-role accountability (QA, Process, Manufacturing, Materials, etc...) is of paramount importance. in fact nothing yielding results, gets to be done without followup in continual improvement action unless individuals are
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Fri May 16 10:06:44 EDT 2003 | pjc
Traceability of raw material, personnel and equipment performance during product manufacture: Tracing raw material is done by recording the material mfg.�s batch-code that they assign during the material�s manufacture. This is everything from the fl
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
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