Electronics Forum | Wed Dec 27 23:04:10 EST 2006 | i want to learn from u
Most of pcb have white/black printing at bottom side of them to indicate the chip location. Normally, this printing are the same location to the place that glue will be mount. My problem are the glue size between the point that have printing and not
Electronics Forum | Mon Jun 05 14:09:36 EDT 2000 | Jason
We would like to gauge or precentage of production line failures to industry standard AQL level. What would be an acceptale AQL level for assembled pcb's or finished units leaving the factory?
Electronics Forum | Sun Jul 02 23:01:02 EDT 2017 | bentepcb
Hi, if you need produce 500pcs only, I suggest you choose the professional prototype for small volume one. Such factory can meet your requirement and will always provide good service, if you choose the big factory, may be the qualitry of board is not
Electronics Forum | Thu Jan 30 06:44:20 EST 2003 | Grant Petty
Hi, Great, thanks for the info! Regards, Grant Petty Blackmagic Design www.blackmagic-design.com
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef
You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma
Electronics Forum | Mon Jan 27 09:43:15 EST 2003 | davef
Sorry. I mistyped information on the guidelines. It should be: SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments Order SM-785 from: IPC 2215 Sanders Rd Northbrook, IL 60062-6135 847-509-9700 When you are ordering t
Electronics Forum | Tue Dec 19 03:32:11 EST 2006 | ungun
Is there any method or machine that i can use to check glue size. I need to check 90% of the bottom side pcb area that have 200 glue point within 15 to 30 sec.
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