Electronics Forum | Fri Sep 07 23:59:24 EDT 2018 | leohdez
I have this problem the led rises after passing through the reflow oven. Could they help me?
Electronics Forum | Wed Sep 25 05:08:33 EDT 2002 | msimkin
Gregg, We had a similar problem with our 0603 leds. They were being placed bang on, however, during the reflow, they twisted, fell sideways etc. We played with our profile, played with the paste volume & land pattern design, and only had a small impr
Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory
Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
| 1 |
