Electronics Forum: smd board tips distance between (Page 1 of 1)

Pick Up Error

Electronics Forum | Fri Aug 06 11:07:49 EDT 2004 | JB

"I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!" It is purely mechanical.On our high speed turret the machine knows the distance between the tip of the nozzle and the top surface of

Re: SMT soldering

Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud

Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times

CP6 Nozzle sticking

Electronics Forum | Tue Jan 24 18:21:22 EST 2006 | fredc

I have some old Fuji windmills here and I checked the usefull travel. It is approxiamately 1.5mm, the nozzles are suposed to have .3mm "preload" wich will take away from the usable overtravel. The windmill I checked is a reject that from when we rebu

adhesive on pads

Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef

You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Re: No Free Beer But...

Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach

| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

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