Electronics Forum | Thu Jul 09 08:03:48 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Thu Jul 09 08:04:11 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Thu Aug 08 13:11:00 EDT 2013 | shawnvike
I have a new product to build and it uses a SMD EMI board shield. I have never done this before. There are multiple components under the shield, do I place the components and then the shield and then reflow? Or do I have to reflow the components, ref
Electronics Forum | Fri Nov 11 09:18:28 EST 2005 | chunks
EMI shields are no fun! Your process will depend on your design and condition of the shields. We always break the shields into their own process. Because the shields are never flat, screen printing paste and trying to reflow them only caused huge
Electronics Forum | Mon Oct 09 15:53:49 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Mon Oct 09 15:57:10 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Thu Aug 08 15:47:07 EDT 2013 | joeherz
Shawn, Wow. This is a tough one. The part is a 1 pc where I'm used to seeing a 2pc. In our case, we have several assemblies using a 2 pc system (see Laird BMI-S-207-C and BMI-S-207-F). The "C" and the "F" stand for Cover and Fence. The Fence is
Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY
In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
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