Electronics Forum | Mon Nov 05 02:51:48 EST 2007 | omidjuve
our boards have many smd pads that has vias under them so when the screen printer wants to print the solder paste on it , it will penetrate through the via to the bottom side of the board and cause many problem for us . i want to know that is it sta
Electronics Forum | Mon Nov 05 07:22:02 EST 2007 | aj
Hi, We have had this before - yes they can be plugged and metalised on top . aj...
Electronics Forum | Tue Nov 20 06:02:11 EST 2007 | mattkehoe
http://www.sipad.com/sipad_vip.htm mk
Electronics Forum | Fri Nov 23 17:33:11 EST 2007 | mika
English => Swenglish, is not so good... Ds.
Electronics Forum | Fri Nov 09 10:15:27 EST 2007 | devajj
Of course if you are an OEM you could go back to your design engineers and tell them via's in SMD pads is unacceptable. Put that in your DFM design guidelines. If you are an EMS provider you can also influence your customer by explaining the impa
Electronics Forum | Tue Nov 13 09:32:28 EST 2007 | kpm135
For the simple fact that the via in the middle of the pad causes the solder to wick into the hole instead of flowing out across the pad and part. Thus cause insufficient solder issues.
Electronics Forum | Tue Nov 13 08:11:16 EST 2007 | grantp
Hi, What is this unacceptable? Designed the PCB is much easer if this is possible, so it would be really good to know why via in pad is a problem in production. Grant
Electronics Forum | Tue Nov 13 20:29:03 EST 2007 | grantp
Hi, What size via's are you guys seeing, as the ones in our products are incredibly tiny, and via's are very small now days. The via's on the boards we have are dramatically smaller than the pad on an 0402. Grant
Electronics Forum | Mon Nov 05 06:27:23 EST 2007 | grantp
Hi, We are also interested in this, and I have heard you can get the PCB's with the via's plugged. Also, if the via's are small, the solder should not penetrate? Anyone have any further info? Grant
Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz
In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a
