Electronics Forum | Fri Sep 04 04:39:08 EDT 2015 | grahamcooper22
Maybe look at reducing the time above liquidus to @ 60 seconds. HF materials tend to want tighter reflow profiles...halogen activators are great at higher temps and longer reflow profiles..but HF prefer shorter profiles. The HF pictures look like the
Electronics Forum | Fri Jul 21 13:42:11 EDT 2006 | Chunks
Paste too thick. Paste not aligned on pad. Part not aligned on pads. Part leads not straight. Oven profile. Paste slump from warm board. Operator before oven thinks they can place IC better than placement machine - so plays IC hockey with part. Oven
Electronics Forum | Tue Nov 21 11:16:48 EST 2006 | Mk
I am having issues with parts falling off a double sided board in the Vitronics but not in Heller oven. The oven profiles are as close to each other as I can get them. Does the Vitronics have more air flow? The Heller is an older oven and the chain d
Electronics Forum | Sun Aug 06 19:05:38 EDT 2017 | zsoden
OK thanks. I had assumed that since the soldering was generally smooth and we were having no issues with bridges that the flux would be operating fine. But there really isn't much left to check so I'll get my profiler fixed (the thermocouple has been
Electronics Forum | Tue Feb 08 19:24:30 EST 2011 | swag
We are going to buy a new reflow oven this spring. It will replace one that is currently on-line. I have a small handful of golden boards wired with thermocouples and a ton of data to support the transfer of those specific builds. The hurdle is th
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Wed Jul 19 21:11:40 EDT 2006 | ec
Hi Dave, Sorry that I did not explain clear enough. What I mean normally after reflow, the solder joint is very smooth and there is wetting. But now we see there is hole on the solder surface and is not on the same loaction. This product have been r
Electronics Forum | Wed Jan 23 12:35:24 EST 2008 | bobpan
Here is a few things to try.... 1. Spin the z-shaft with your fingers and make sure it is smooth and easy to turn. 2. Check your handling in your profile for the part that the software is locking up on.......You cannot go any slower than 40% or this
Electronics Forum | Wed Mar 03 23:07:59 EST 2010 | davef
If your "engineer reviewed the reflow profile and said this was not related to reflow conditions," then what does he think it's related to? We think that a increased effort to improve the thermal recipe to solder this part is required, because: * S
