Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks
Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach
Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Tue Mar 06 15:59:33 EST 2007 | pima
hello I would like to ask you for advise. I have problem with one of my SMT line and skewed parts at the end of line after reflow. My line is composed: DEK, 3d visual inspection of paste printing, IP3, 8 zones reflow oven. I m builidng there produc
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
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