Electronics Forum | Wed Nov 20 16:30:43 EST 2002 | Gris
Hi Here is an recent article on compatibility of Sn/Pb paste with Sn/Bi component finish ? Can somebody who is intrested help with what the contents are ? Thanks http://www.denso.co.jp/DTR/vol6_no2/dissertation13.pdf
Electronics Forum | Fri Jan 07 13:17:48 EST 2005 | bschreiber
3) There are several papers on the safety of cleaning PCBs and ICs using ultrasonic technology. The latest is in the October 2004 issue of SMT magazine by William Kenyon, "Why Not Ultrasonics?" Most of the studies have been performed by Dr. B.P. Ri
Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef
I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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