Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sun Aug 05 01:31:08 EDT 2012 | dws123
printed circuit board assembly used to mechanically support and electrically connect electronic components using conductive pathways.it is a electronic device made by copper.it is a cheaper and useful .so we used in electronic devices.
Electronics Forum | Mon Aug 06 13:17:31 EDT 2012 | leemeyer
Contact Sipad Systems and see if your board is a match for their process. They use a flux that stays tacky for weeks. We have used them in the past for exactly this reason and everything worked out well.
Electronics Forum | Wed Jul 09 17:07:51 EDT 2003 | msjohnston
Like many others out there I am new to SMT assembly on flex circuits. In the past, we purchased flex assemblies manufactured from a sub-con. Now we will be building internally. Are there any guidelines when building products with flex circuits? Wa
Electronics Forum | Mon Sep 24 06:12:23 EDT 2012 | weyes
About my company Shenzhen flytop technology co.,ltd is a professional PCB and PCBA manufacturer in china. We have been manufacturing PCB and offer assembly services with component supplying for client around the world over 10 years. Now we have
Electronics Forum | Thu Dec 23 15:29:48 EST 1999 | Glen Robertson
Mike - I'm not in the EMS business, but I suspect most of them are very reluctant to reveal much about their quoting process. You might want to try some of the third-party data suppliers like Ceeris (www.ceeris.com), and you can also check the C
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef
No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he
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