Electronics Forum | Wed Aug 22 10:57:59 EDT 2001 | wbu
Hi Steven, BGA�s are known for their ability to self align and from own experiance they do. There�s enough documentation on this one available (...don�t have the links present like Dave but I�m sure he will give you enough to spend some evenings rea
Electronics Forum | Wed Feb 07 20:57:31 EST 2001 | Kyle
What are you placing on this equipment? If you are placing flip chips, you need to have a glass plate test system to verify your machine is accurate and repeatable. If you purchase new equipment and plan to place flip chips or ultra fine pitch, it
Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry
If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s
Electronics Forum | Fri Sep 11 09:30:30 EDT 1998 | Earl Moon
| Heeeelllllp. | I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting int
Electronics Forum | Thu Sep 10 17:10:00 EDT 1998 | Steve Gregory
Hi Tim, 8-mil huh? Boy, that's getting down there...you know, placing 8-mil is one thing, but printing solder paste on 8-mil pitch is another. Most of the time when I've seen 8-mil pitch on a board it's been attached with hot-bar...but I guess
Electronics Forum | Wed Jun 09 23:48:38 EDT 1999 | dEAN
| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a
Electronics Forum | Mon Mar 03 09:57:26 EST 2003 | msivigny
Hello markt, If you're only running at 85%, you've got some things to look into! First, it's good you know that you're operating at 85% with some measurables that help you determine that. Now, the easiest methodical way to improve productivity on SMT
Electronics Forum | Thu Jul 10 15:03:57 EDT 2014 | alexeis
Hi, An answer to this question is very complex. The amount of components and their type is only one parameter to determine the level of failure. Additional parameters that can influence are: 1. The density components on the card 2. Machine type and
Electronics Forum | Wed Jun 03 16:26:37 EDT 2009 | wisch123
The most innovative new technology today is ccoming out of Fuji. They don't really advertise, so if you haven't gone to a show lately you might not have seen it. The machine is call the XPF-W and it sets the new standard for quality, accuracy, reliab
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
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