Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Thu Aug 27 05:49:53 EDT 2015 | alexeis
Hi, To calculate both values you need: 1. Theoretical speed of all machines (Printer, SMT, Reflow). This is a basic upper limit value of speed. Use it for calculate a maximal theoretical values as upper limit. For real values, read next. 2. High r
Electronics Forum | Mon Jul 08 08:29:14 EDT 2013 | emeto
You can use any metric ruler to do that. Examples: Pitch 2mm x 200parts = 400mm length or Pitch 4mm x 100parts = 400mm length You can also calculate approximately how many parts you have on the tape by using formula. I don't have the formula but
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Tue Mar 12 10:16:05 EDT 2013 | bocci572
Yes the components are flat and no larger than 50mm in size. Most are full rings or just an arc of a ring. I understand fully the best way to have the capabilities proven would be to have the vendor demonstrate. I am kind of looking at what people
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Mon Oct 01 16:41:22 EDT 2001 | davef
We do not assemble with these connectors any longer, we replaced them with a connector from somebody er other, like Teka [one of the pioneers of solder-flux bearing lead technology and a supporter to SMTnet], Samtec, Advanced Interconnections, Mill-M
Electronics Forum | Sat Oct 22 22:10:09 EDT 2011 | unisoft
Hi maybe this will help Rich larue rlarue@unisoft-cim.com ProntoGERBER-CONNECTION ( http://www.unisoft-cim.com/gerber_connection.htm ) imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and c
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