Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess
WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can
Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach
| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f
Electronics Forum | Fri Jan 06 05:03:11 EST 2012 | richieoreilly
Hi All, Just wondering if anyone is placing 0201 components in volume. If so What pad layout are you using, i.e. pad size, shape and spacing. Also are you pads and fiducials solder mask defined or copper defined. Can you also let me know the rough q
Electronics Forum | Tue Dec 14 13:39:16 EST 1999 | KA
Hello Everyone! I have encountered a situation where I have surface mount components on the backside of the board and I need to wave all the through hole leads on the backside as well. Can this be done? I thought of the possibility of adhering the
Electronics Forum | Fri Jan 06 13:47:15 EST 2012 | davef
Your starting [and finishing] point should be IPC-7351B Land Pattern Calculator and Tools - http://landpatterns.ipc.org/default.asp For more, look here: * http://www.smtnet.com/bob-willis/pbdai.html * http://www.onboard-technology.com/pdf_novembre
Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef
I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever
Electronics Forum | Fri Apr 27 11:26:53 EDT 2001 | pteerink
Check out IPC SM-785 Land pattern guidelines for SMT www.ipc.org Phil
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Thu Apr 26 18:39:45 EDT 2001 | jagman
I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepabl
Electronics Forum | Fri Nov 08 18:36:31 EST 2002 | leeloo
Nowadays I have a problem, I am in chsrge of the section of smt in my company, have a normal process inside my department with a minimal level of mistakes, the problem happens when the material is liberated to the lines of production on happened for
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