Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Tue May 06 06:29:06 EDT 2003 | yukim
Hi, No, the layout is different, but both have chips located arallel and perpendicularly to the flow direction. And we do have defects in both orientation. What about the PCB warpage? Sometimes we find warped PCBs. Could this affect? Thanks, Yu.
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Fri Jun 23 09:36:58 EDT 2000 | C.K.
Chrys: Funny that you mention that, but here at my company, our oven is blamed on almost everything: skewing, tombstoning, solder shorts, etc.... In fact, we often have to tell the supervisors, "It's not the oven because we don't turn the skewing
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Mon Dec 10 16:44:51 EST 2001 | davef
Good for you!!! Similar to Steve's comments ... 1. NON-WETTING DEFECT: Yes. Your Lonco is a �stand and deliver� flux. Not some limp wrested impersonation of a flux like most nc fluxes. Without speculating about �incompatability�, recognize that
Electronics Forum | Tue Sep 08 13:12:05 EDT 2020 | spoiltforchoice
> Tombstone is often caused by an imbalance of > temperature, pad shape or spacing, component > termination, and component positioning. Pate > formulation and reflow atmosphere are other > common causes. Looking at the pads and &
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