Electronics Forum | Tue Jul 08 07:01:40 EDT 2003 | davef
Try: * ANSI/J-STD-004 - Requirements for Soldering Fluxes * ANSI/J-STD-005 - Requirements for Soldering Pastes * ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering App
Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Thu Jul 15 04:33:56 EDT 2010 | jevans
We've recently purchased a second hand smt line which contains an Ersa Hotflow 9 reflow oven.We were informed that this oven was capable of handling a lead free process.The oven was manufactured in 2000,and it has come to our attention that it can on
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Mon Jul 18 01:47:29 EDT 2005 | Cal
I would suggest 1) Use the profile that is suggested with the BGA types you are using or 2) Have you solder paste rep visit for a half day and help profile your machine. Remember if they want to keep you as a paste customer they will help. Enjoy,
Electronics Forum | Fri Mar 22 11:28:13 EST 2002 | sam
I believe you need some sort of "flat top" for this connector. I have ordered special "tops" for connectors we have placed in the past, the top is simply removed before any item is plugged into it. This also protects the connector after the board i
Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Tue May 04 10:59:23 EDT 2004 | Evtimov
Hi, It depends of your boards(are they for SMD or not) and how many boards you assemble. The process at all is like that: 1.Stencil printer - to adjust the paste 2. Pick and place machine(for your quantity) 3.Reflow oven Theese are the machines you
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
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