Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Wed Feb 01 03:17:10 EST 2017 | rob
Ok, that's small - I think you may need a special semi-conductor printer for this - positional accuracy on a "normal" SMT printer is no more than 20 micrometres from memory. In my semiconductror fab days we were printing with a positional accuracy
Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Mon Nov 05 13:33:08 EST 2007 | slthomas
Heck no, I mean we print relatively slower on complex boards, as in 1 inch/sec (25.4mm/sec), and maybe 2 inches/sec. (51mm/sec) on less complex boards. SMT is not a bottleneck in our plant and printing never the bottleneck in SMT, so I see no need t
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Wed Dec 03 11:55:42 EST 2014 | spoiltforchoice
I think there are several answers: 1)Design Fail - slap whoever created it 2)Fit that connector as a manual process after the PCB is finished. 3)Print side 2 using a jet printer 4) Shield the fragile LGA and reflow it twice anyway. 5)Use a thicker PC
Electronics Forum | Wed Dec 03 10:44:03 EST 2014 | kkay
We have a smt connector on side one of our pcb that overhangs through the board to the second side. We can't figure out how to print the second side with this part sticking out. Unfortunately we cannot run the second side first due to an LGA that has
Electronics Forum | Wed Jul 14 15:36:34 EDT 2010 | remullis
98% to 99% pass yield should be your target. The previous company I worked for, we were able to meet these goals with most all of our products. It took us some years to achieve this level of pass rate. Of course analyzing and good reporting from some
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
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