Electronics Forum | Mon Jul 18 02:47:27 EDT 2005 | grantp
Hi, It sounds like your a little new at profiling, and can be difficult to do well. We purchased a KIC profiler that has software that will take your profile data and tell you the best oven temperature settings and conveyer speed to use. You need
Electronics Forum | Tue Mar 01 08:21:37 EST 2005 | David Bratcher
What thickness is required to process a double sided board with white tin? Is there an IPC standard? If rework is necessary, what is required?
Electronics Forum | Mon Jul 18 01:47:29 EDT 2005 | Cal
I would suggest 1) Use the profile that is suggested with the BGA types you are using or 2) Have you solder paste rep visit for a half day and help profile your machine. Remember if they want to keep you as a paste customer they will help. Enjoy,
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Wed Aug 10 04:15:01 EDT 2005 | vinitverma
Ari, I would suggest you make a checklist of all your requirements (not just large scale production) and prioritize them with weights assigned to each. Fill in the checklist for each equipment and manufacturer and you'll have the results out. I wou
Electronics Forum | Thu Jun 12 04:22:00 EDT 2003 | gaoliangcheng
Hi, our factory is introducing the FPC process. I have some question to ask.Could anyone reply/ 1.how can we fix the FPC in the mounting and printing process? 2.how can we set up the temperature profile? Thanks.
Electronics Forum | Sat Jun 14 17:08:35 EDT 2003 | MA/NY DDave
Hi I don't see any answers so let me ask a question so even if I don't pop back in others will do their best. Is FPC (Flexible Printed Circuit) or is it something else. I only know cause I have been into that flexible circuits. YiEngr, MA/NY DDav
Electronics Forum | Mon Mar 30 10:43:31 EDT 2015 | dazdoc1977
Cheers Rob, I thought that I wasn't far from the true answer....I figured that if we were to use a "first piece assembly " quote to get a first off through smt production, This would include start to finish process....e.g Programming to first board
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
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