Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia
Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Fri Aug 27 14:28:57 EDT 2004 | pjc
http://www.vtekusa.com/products.htm
Electronics Forum | Fri Aug 27 12:56:27 EDT 2004 | cyber_wolf
Can anyone tell me where I can find a pull tester/guage for the overlay on tape and reel? Thnx
Electronics Forum | Fri Aug 27 14:59:02 EDT 2004 | anonymous
GPD,General Production Devices has a T&R Peelback Force Tester among their product offerings. 1-800-pickgpd I am not aware of other vendors offerings.
Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony
I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where
Electronics Forum | Tue Aug 12 09:52:58 EDT 2014 | thiagofrego
Would like to know if some exists norm that refers the parameters for test of extraction (pull test) of components SMD using adhesive.
Electronics Forum | Thu Jan 07 03:21:13 EST 1999 | Dorothy Ho
I'm looking for some SMT test sockets. Could you tell me who can do a similar job as Ironwood Electronics, Inc.? Thanks.
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
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