Electronics Forum | Thu Jan 26 12:46:53 EST 2017 | dyoungquist
We run double sided boards that have large SMT electrolytic caps on the top side using the same profile for both sides. The trick is to do the bottom side first, then the top side. That way you do not need to glue down the large caps.
Electronics Forum | Tue Feb 19 10:50:13 EST 2019 | rgduval
Call Heller directly, and give them the oven, and relative thermal density of the board, as well as the solder paste that you're using. They'll be able to give you a baseline profile to start from (both RTS and RSS). Otherwise, use a thermocouple p
Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY
Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi
Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th
Electronics Forum | Tue Feb 19 12:28:26 EST 2019 | slthomas
Presumably you're talking about lead free, but you don't say. Heller can probably provide you with a starting point, as rob has already pointed out, but you do need to develop the capability to perform profiling yourself. That oven should have ECD
Electronics Forum | Mon Jan 09 19:25:15 EST 2017 | fadzril
It shouldn't be any issue if you measure the top reflow settings using bottom profile board & the results are OK. To common the reflow profile, both bottom & top profile measurement are taken & analyzed. This, too, can be applied, even for differen
Electronics Forum | Tue Jan 24 22:43:20 EST 2017 | david_chiu
Absolutely ok!! We already co-use the same profile setting for top and bottom side to avoid line efficiency loss for more than 10 years. But only one thing you should careful is the heavy mechanical parts on bottom side may drop during reflow proces
Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376
I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven
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