Electronics Forum | Mon Jan 03 11:33:15 EST 2000 | Zaklas, Yosef
Dear Sirs: We use BGA ceramic components in our assemblies. We would like to know if there is a technical problem of SMT assembly and reflow of these components on aramid surfaces. Yours immediate reply would be appreciated.
Electronics Forum | Tue Jan 04 19:55:46 EST 2000 | Rob Thomas
Hello Yosef, non woven aramid reinforced pcb's are used where is a need for low CFT (coefficient of thermal expansion). Traditionally aramid pcb's were used in military applications in order to reduce the stress/failure rate of solder joints during
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Electronics Forum | Wed Jul 14 13:41:40 EDT 2010 | rway
We are running SMT products and have been for some time now. First, I wanted to check with you folks to see what an acceptable FPY rate, or what you would consider and acceptable rate, is. Secondly, we are having issues primarily with product that
Electronics Forum | Sat Nov 10 21:15:04 EST 2007 | mika
make 4 square rounded corner apertures around the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. We SMT-mount & reflow soldering various QFN packages onto our customers pcb:s wi
Electronics Forum | Fri Nov 05 21:41:46 EST 1999 | chartrain
Temperature vs time is what soldering is all about. The faster you run your conveyor, the more heat will have to come from the pot for a given assembly. Example: You heat the board to 200F top side through the preheaters. Eutectic 63/37 melts at 361.
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Wed Feb 03 16:45:20 EST 1999 | Mark Henebry
Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connector
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