Electronics Forum: smt spring loaded pins (Page 3 of 5)

Re: Stencil Printing

Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis

If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik

SMT Pick and Place

Electronics Forum | Thu May 10 15:11:53 EDT 2001 | jdtpfacreate

Paul, My company offers an excellent solution for low volume/high mix applications. The issue always becomes how can you reduce downtime/changeover. There are few features on our machines that allow you to do this effectively: -Load feeder

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

solder paste printing

Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf

“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of

what software is out there that will extract XY centroid from gerber data?

Electronics Forum | Wed Jan 22 10:35:38 EST 2014 | unisoft

_a class=roll > href="http://www.graphicode.com/GC-PowerPlace" > target="_blank"_http://www.graphicode.com/GC-Power > Place _/a_this does, I had a dabble and while it > does seem quite capable the learning curve is > quite steep and I'd wager th

Re: PTH Cut Form Equipment

Electronics Forum | Tue Jul 13 14:36:55 EDT 1999 | JohnW

| I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick. |

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Re: Process Change

Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Re: Process Change

Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change

Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We


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