Electronics Forum | Thu May 05 09:46:04 EDT 2005 | davef
Board fab, Defects, Pad coatings, Gold black plague articles 1 Nick Biunno's article: http://www.nukcg.org/downloadfiles/Hadco%20on%20Immersion%20Gold%20failures.pdf 2 George Milad's article: http://www.circuitree.com/ct/cda/articleinformation/featu
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Electronics Forum | Sun Feb 07 10:41:16 EST 2010 | davef
Makes us wonder how well the connections on the component match with the pads on the board.
Electronics Forum | Sun Feb 07 11:56:05 EST 2010 | mystkldy
Makes us wonder how well the connections on the > component match with the pads on the board. The pads are actually larger than the leads on the part, but I think we may have figured it out. We believe the conveyor vibration is causing it. When we
Electronics Forum | Thu Sep 03 15:43:18 EDT 1998 | Tim Flanagan
I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior for
Electronics Forum | Fri Sep 04 09:33:40 EDT 1998 | Stefan W.
| I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior fo
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