Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Thu Apr 28 12:00:15 EDT 2005 | pr
You might try..... http://www.wpsales.com/ or SMT research They sell aftermarket nozzles etc. and if you show them a market for these Vac. pads I bet they would start carrying them (they may have them already). I'm sure there are others out there b
Electronics Forum | Thu Jun 12 09:42:06 EDT 2014 | spitkis2
I am looking into Vapor Phase with Vacuum and Inline Reflow with Vacuum (besides Heller I believe a German company SMT has something comparable). There are a couple of companies I found that make vacuum ovens for soldering of hybrid microelectronics
Electronics Forum | Sun Nov 01 10:43:30 EST 2009 | greg_diaz
Does anyone have any historical data on vacuum problems with SMT equipment at High Altitudes?
Electronics Forum | Wed May 05 15:27:06 EDT 2010 | bradlanger
Make sure that both lead frames are contacting the PCB pads when the part is on the placement head. We had an SM xfrmer that we were handling with vacuum by a ferrite cap that was not glued on straight. The part would contact one set of pads and get
Electronics Forum | Mon Feb 21 13:57:37 EST 2005 | JB
Start by verifying the component definition, the thickness is critical. HSP 4796 uses nozzle 81 for 0402's. Make sure is using the right nozzle. If you need to, use the autoteach function to physically teach the dimensions of it, thickness included.
Electronics Forum | Mon Jun 04 23:52:57 EDT 2012 | rway
Actually, if you experience lack of witness marks, you probably have a problem. Witness marks are OK and will not affect your assembly. I assume this is an SMT assembly we are talking about, in which case, this is what your test pads are for. You
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