Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven
| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |
Electronics Forum | Thu Apr 08 07:01:51 EDT 2010 | muarty
Hi, Looking for views and some opinions on the best systems to use to clean pads (particularly BGA) prior to carrying out replacement of parts. I'm thinking of vacuum type desoldering systems. Obviously braid is an option which we currently use, but
Electronics Forum | Mon Jun 05 18:45:07 EDT 2017 | zsoden
Hi Steve, I agree with your assessment, it would certainly seem like the pads are de-wetting. But what could be the cause of this? Contaminated solder? The boards are new out of vacuum sealed bags (with desiccant sachets), so I can't see it being the
Electronics Forum | Thu Dec 08 16:15:03 EST 2022 | charliedci
Looking for source for pads to place SMT equipment on the raise the working height. Thanks
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Tue Jul 06 15:06:35 EDT 1999 | Mike Demos
Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. This
Electronics Forum | Tue Jan 13 19:16:03 EST 2004 | pjc
Dedicated tooling uses what MPM calls an "H" tower. You mount the board support plate (dedicated tooling) on top of the H tower. If boards are only single-sided SMT, meaning only components on one side, the board support plate is flat with vacuum hol
Electronics Forum | Thu Mar 22 04:03:04 EDT 2012 | vinitverma
The difference between FCM I and FCM II is not only the use of pusher. The vacuum calibration pads are also in different locations - in front in case of FCM I and in the rear for FCM II. Also the pick positions (coordinates) as well as location numbe
Electronics Forum | Tue Aug 24 06:40:18 EDT 1999 | Gyver
| | | Hello everyone, | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. |
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