Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Wed Jul 14 15:36:34 EDT 2010 | remullis
98% to 99% pass yield should be your target. The previous company I worked for, we were able to meet these goals with most all of our products. It took us some years to achieve this level of pass rate. Of course analyzing and good reporting from some
Electronics Forum | Mon Feb 14 11:59:50 EST 2000 | Charlie
If you would be so kind, I need some fundimental data for several sources. The question is, 'What is your SMT yeild directly after reflow?'
Electronics Forum | Wed Feb 16 12:57:54 EST 2000 | Claude Couture
Hi! We currently have less than 200ppm after reflow. Our products have practically no fine pitch, so it's easier to reach a low ppm.
Electronics Forum | Sat Feb 19 13:53:46 EST 2000 | Dean
...reasonable benchmark. 30 to 100DPMO is considered world class. All else? Well lets just call it "not-so-world-class". :) Dean
Electronics Forum | Sat Feb 19 04:16:46 EST 2000 | Michael H
Hi What would be considered a reasonable benchmark when placing finepitch devices say 24, 15mill pitch devices avg 2000 joints and a total pad count of 6918. I would be gratefull for any advice on this matter, also if anyone can recommend any real
Electronics Forum | Mon Feb 21 12:02:58 EST 2000 | K. Ckak
Hi Dean, Can you please tell me how we could incorporate DPU to DPMO? Also, can you please explain the deviation factor DPU * deviation factor = DPMO ? Should we take dollar value or number of joints? Explain with calculations if you please. Thanks
Electronics Forum | Wed Jul 17 12:30:26 EDT 2002 | Mike Proffitt
I am working to improve the yield on a SMT line and am trying to find out a benchmark figure, anyone who could guide me to the expected yield for soldering related issues on a board containing approximatly 4000 joints I would be very greatfull.
Electronics Forum | Thu Aug 29 12:48:26 EDT 2002 | slthomas
Assuming all things are equal (attention to good DFM guidelines, well trained and capable operators, well maintained equipment, etc.), which would you expect to have the higher process yield, standard SMT/through-hole all topside, or all SMT bottom (
Electronics Forum | Mon Jul 09 11:59:25 EDT 2007 | sck1971
Does anyone have any industry standard yield factors to load at the component level to account for set up scrap and machine waste during production? I'm assuming there are different percentages used for each package size (0402, 0603, SOIC8, etc) but
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