Electronics Forum | Sun May 13 02:08:26 EDT 2012 | isd_jwendell
In testing 63/37 SnPb NC paste I have seen HUGE differences in performance. Have you tried a different paste? I prefer AIM (NC257-2), they have performed well in each round of testing. My observations regarding mixing old and new paste: The paste ha
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Sat Jan 19 04:50:48 EST 2019 | tirthkar8980
why two high melting temperature metals are getting melt earlier or mean at very low temperature after mixing. Ex :- Tin (sn) - 231 C melting point lead (pb) - 327 C melting point But Sn/Pb - 63/37 melting temperature is 183 C
Electronics Forum | Fri Jan 11 06:28:40 EST 2019 | tirthkar8980
what is solder flux? what contents are used for manufacturing solder flux for solder sn/Pb 63/37 ( Application Wave Solder machine )
Electronics Forum | Tue Mar 28 15:11:56 EST 2006 | GS
Hi MLC, did you profiled the BGA itself? I mean detect Temperatures on middle/central ball vs external ball and see how much is the delta Temperature. Best practice is to keep the delta T at minimum as possible especially on a so large BGA. Sure
Electronics Forum | Tue Feb 06 23:01:44 EST 2007 | Wayne
The QFN is found to have contact problem during FCT. The paste that I am currently using is SnPb 63/37 water soluble paste. Is it because of water soluble paste? (unable to clean after reflow process as QFN is entrapped by paste/flux) Should we use
Electronics Forum | Mon Sep 08 02:39:37 EDT 2008 | akareti
By connector, you mean socket? Connector use for board to board connection from FCI, MFG P/N: 84500-202 What is the material of the connector(socket)? Is it very frigale? Housing: liquid crystal polymer Solder ball: SnPb 63/37 how big are the bal
Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Fri Jan 24 19:19:11 EST 2003 | MA/NY DDave
Hi Don't really know what "your grainy" means. It could be good, marginal, or bad. You need to get some photos or micrographs of what is normal and off-normal. Compared to Sn/Pb 63/37 on mostly Sn it should look visually different. Every time you c
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
