Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp
2000 cycles of -40/+150C thermal cycling.
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
Electronics Forum | Thu Apr 16 09:54:12 EDT 2009 | davef
We know virtually nothing about your process, but here's some guesses: * Turn-off the nitrogen * Change from Sn63 to Sn62 * Change to a low-tombstone paste * Change the thermal recipe: slower ramp, longer soak * Do a better job of placing components
Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be
Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim
Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha
Electronics Forum | Mon Dec 18 17:56:26 EST 2000 | Dave F
Does the thermal conductivity of a copper trace on a printed circuit board change as the copper oxidizes? Is the oxide on copper a thermal insulator? If so, should it be considered in an analysis of thermal resitivity between a ground plane and a h
