Electronics Forum | Thu Sep 19 11:02:17 EDT 2013 | hegemon
If there is only a single lead free BGA on the BOM, I would suggest a "hybrid" profile. Use regular solderpaste (SN63/pb37) and peak your temperature at around 225C. Allow a bit longer TAL to let the two solders co-mingle at the BGA joints. You are
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Thu Sep 13 11:01:39 EDT 2007 | cyber_wolf
Fuji specs out Omega 66 grease for the solenoid sliders on older CP machines. These solenoids run hot. Its interesting to me that this grease is designed for extremely low temperature applications. Whats up with that ? http://www.omegaoil.co.jp/ind
Electronics Forum | Tue Aug 22 11:17:04 EDT 2000 | Dr. Ning-Cheng Lee
The classic dilemma, cost vs. performance. In typical applications, Sn whisker growth is not an issue. It only seems to occur under extreme use (high stress, low temperature)conditions. Until this issue is fully addressed, Pd seems to be the favor
Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F
| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th
Electronics Forum | Fri Nov 13 08:43:02 EST 2009 | herman
reash, Go directly to APS and get one of the APS GF-12 ovens. I have been using these for 15 years as a low-to-medium volume oven for general purpose reflow of CCAs up to about 12" by 12" with excellent results. I use them for BGA re-balling, underfi
Electronics Forum | Wed Jun 18 19:26:39 EDT 2003 | gregoryyork
Rules of thumb :- 1. Never over flux - not necessary and waste's money. Never top flux neither 2. Top Board temp. around 70C - 105C or there about's pending what laminate you use. Obviously the more flux you apply the higher heat required/denser PC
Electronics Forum | Mon Oct 02 10:22:13 EDT 2006 | SteveH
We are having issues with cleaning underneath leadless chip carriers due to their extreme low lying nature and I wondered if anyone else had any experience of this. Our process for years has been vapour degreasing with Triklone N, which works, but w
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
