Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Wed Nov 08 08:12:16 EST 2006 | jnaligan
hi... try evaluating eco solder paste Sn96.5/Ag3.0/Cu0.5 from Senju... output is good and i suggest your stencil's apperture ratio with the pad 1:1 when it comes to fine pitches...and BGA pads regards, janry
Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron
WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com
Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
