Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Sat Feb 26 08:37:32 EST 2000 | Dave F
Sze-Pei: Your e-mail address doesn't work. Dave
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
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